Overview
QP Semiconductor's Quality Systems are based upon the military performance requirements of MIL-PRF-38535 and MIL-STD-883 Test Method Standard for Microcircuits.
A detailed description of QP Semiconductor's Quality organization and supporting documentation is covered in the Quality Assurance Manual. Quality Assurance Manual
QML Level V and Q Certification
Transitional Qualified Manufacturers Listing (QML) level Q certification was originally granted by the Defense Supply Center Columbus (DSCC) on July 16, 1998. Full Q level certification was granted on July 17, 2003. Full V level certification for space level manufacturing flows was granted on November 10, 2004. QML Certification letter and QML Certification
The QML certification includes the following technologies, facilities and approved subcontractors:
Technology Types:
BiPolar, Linear, MCO, Digital, FAST, ECL, CMOS, BiCMOS, HCMOS
Product Types:
Bipolar Memory, Linear, Microcontroller, SRAM, PROM, EPROM, PLD and Logic
Assembly Operations:
QP Semiconductor, Santa Clara, CA
Millennium Microtech (Formally Alphatec), Bangkok, Thailand
Electrical Operations:
QP Semiconductor, Santa Clara, CA
Millennium Microtech (Formally Alphatec), Bangkok, Thailand
Environmental Test Operations:
QP Semiconductor, Santa Clara, CA
Millennium Microtech (Formally Alphatec), Bangkok, Thailand
Products Qualified and Listed with DSCC
QP Semiconductor qualifies a larger percentage of it's product lines in full compliance with MIL-PRF-38535 requirements and submits these qualifications for listing with DSCC than any other manufacturer. Current levels of support from all QML manufacturers is analyzed via data provided by DSCC and published via this linked page: Number of Qualified Devices Ranked by Vendor. This hyperlink to DSCC provides the full list of all devices QML qualified for QP Semiconductor: Devices Listed with DSCC for QP Semiconductor.
DSCC Approved Test Methods
Laboratory Suitability to MIL-STD-883 Test Methods was originally approved by DSCC in July 1997, and re-certified on July 17, 2003 and November 10, 2004. Laboratory Suitability Certification letter and Laboratory Suitability Certification
Product Quality and Reliability
All new products are designed to meet MIL-PRF-38535 requirements, including metallization, step coverage and current density.
Scanning electron microscope (SEM) inspections are performed on procured wafers and die to verify the step coverage and current density requirements of MIL-PRF-38535.
All standard products are screened to the requirements of MIL-PRF-38535. This includes MIL-STD-883 Method 5004 screening and MIL-STD-883 method 5005 Qualification and Quality Conformance procedures.
Traceability to the wafer lot is maintained throughout manufacturing. A unique mark lot number is marked on the finished device for this purpose.
Die Qualification Testing
For die or wafers manufactured by an uncertified source, Qualification testing is performed per QP Semiconductor QAP-27, Table 1.
For Qualification of die or wafers from a DSCC certified source, the same testing is performed per QP Semiconductor QAP-27, Table 1 with the exception of Subgroups D3 and D4 which are done as part of the periodic Group D QCI testing.
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