QP Semiconductor, now a "fabless semiconductor company," has complete capability for the design, development and production of integrated circuits. From product design to finished product, QP Semiconductor has the systems, procedures, qualifications and expertise to provide product on time to your requirements.

Design

QP Semiconductor utilizes state of the art CAD tools to replicate DMS/obsolete products. We have design capability in-house and have established a design and engineering center in Europe.

Wafer Fab

QP Semiconductor has established partnerships and qualified key wafer foundries to support our replacement product designs. As an example, QP has a long term agreement for QML wafer foundry services with Macronix International. Foundries and process technology are carefully chosen in order to duplicate the original process as closely as possible.

Assembly
QP Semiconductor has QMLcertified internal and offshore assembly capability. Internal assembly is located in Santa Clara, CA, in our class 1,000 QML certified clean room. Assembly operations are performed at class 100 laminar flow stations to the exacting requirements of military standards. Both gold eutectic and silver glass die attach are utilized, including gold braze in the SST High Vacuum system. Wire bonding can be either gold or aluminum. In-process monitors (die shear or stud pull and bond pull) ensure that the die attach and wire bond processes remain within control limits. Our SST High Vacuum chamber can support glass frit and solder seal in a highly repeatable, temperature, atmosphere and vacuum controlled process. Most hermetic package types are supported for all of the major technologies (Digital, Analog, Mixed Signal, Memory, and so forth, etc).

Offshore assembly is performed at Millennium Microtech (formerly Alphatec) in Bangkok, Thailand. Millennium Microtech is a QML certified facility for hermetic packages and has capability for high volume manufacturing.

Test and Burn-in
QP Semiconductor has both internal and offshore QML certified test and burn-in capability. Internal test and burn-in is located in Santa Clara, offshore test andburn-in is performed at Millennium Microtech. QP Semiconductor's hardware/software and engineering staff support a wide range of device types, technologies, and complexities. Automated and semi-automated test hardware systems are used to electrically test devices for compliance to military and customer specifications.

Temperature Forcing Systems permit replication of operating temperatures. Our IEEE Bench, which incorporates special purpose instruments connected via LAN, permits read and record capabilities for highly specialized tasks not ordinarily tested on ATE (Automated Test Equipment). Our in-house technical staff design and produce DUT (Device Under Test) cards, load boards, and other specialized circuitry. Wafer probing and other processing of die-in-wafer form are supported.