| Size |
Description |
Package |
SMD Number |
Part Number |
Die Mfg |
Speed (ns) |
| 64K |
8K x 8 |
DIP, LCC |
85102 |
27C64 |
AMD |
200 |
| 128K |
16K x 8 |
DIP |
5962-87661 |
27C128 |
AMD |
70, 90, 120, 150, 170, 200, 250, 300 |
| 128K |
16K x 8 |
DIP, LCC |
5962-87661 |
57C128FB |
Waferscale |
70 |
| 256K |
32K x 8 |
DIP, LCC |
5962-86063 |
AT27C256R |
Atmel |
55, 70, 90, 120, 150, 170, 200, 250, 300 |
| 256K |
32K x 8 |
DIP, LCC |
5962-86063 |
57C256F |
Waferscale |
45, 55, 70 |
| 256K |
32K x 8 |
DIP, LCC |
5962-86063 |
AT27C256L |
Waferscale |
170, 200, 250, 300 |
| 512K |
64K x 8 |
DIP, LCC |
5962-87648 |
AT27C512R |
Atmel |
70, 90, 120, 150, 200, 250 |
| 1M |
128K x 8 |
DIP, LCC |
5962-89614 |
AT27C010 |
Atmel |
90, 120, 150, 170, 200, 250, 300 |
| 1M |
128K x 8 |
DIP, LCC |
5962-89614 |
27C010L |
Waferscale |
120, 150, 170, 200, 250, 300 |
| 1M |
64K x 16 |
DIP, LCC, FP |
5962-86805 |
AT27C1024 |
Atmel |
90, 120, 150, 170, 200, 250, 300 |
| 2M |
256K x 8 |
DIP, LCC |
5962-90912 |
AT27C020 |
Atmel |
150, 200, 250 |
| 4M |
512K x 8 |
DIP, LCC |
5962-91752 |
AT27C040 |
Atmel |
120, 150, 170, 200, 250 |
CMOS EEPROM
| Size |
Description |
Package |
SMD Number |
Part Number |
Die Mfg |
Speed (ns) |
| 16K |
2K x 8 serial |
DIP |
5962-89667 |
24C16A |
Atmel |
1000 |
| 64K |
8K x 8 |
DIP, LCC |
5962-87514 |
28C64B |
Atmel |
90, 120, 200, 250, 300, 350 |
| 64K |
8K x 8 |
DIP, LCC |
5962-87514 |
28C64 |
Atmel |
150, 200, 250, 300, 350 |
QP Semi offers a wide range of military DSCC approved UV-erasable EPROM products from 64K to 1 Mbit in density that support a wide range of Hi Rel and military applications. EPROM products are available in hermetic packages including ceramic DIP and LCC. EPROM products are manufactured using Atmel, AMD and Waferscale die. Products using Waferscale die are exclusive to Arrow Electronics and must be ordered from Arrow. All approved EPROM products are manufactured by QP Semi to MIL-PRF-38535 or MIL-STD-883 requirements.
All QP Semi programmable products have the die manufacturers name marked in a 3 letter code on the back side of the package in order to select the appropriate programming algorithm. Download AppNote Backside Die Coding for the list of codes.
QP Semi is a DSCC / DESC QML certified manufacturer of DMSMS components. |